Imitha yokushisa ye-Ultrasonic manje isiyiphrojekthi yokushisa, imishini yokulinganisa ebalulekile, futhi endaweni yokufaka ngokuvamile kunemigqa eminingi, ngakho-ke ukuze kubhekanwe nezimo zokusebenza ezahlukene endaweni, yikuphi ukwelashwa okulwa nokuphazamiseka okwenziwe imitha yokushisa ye-ultrasonic? Ake sibheke.
Ukucutshungulwa kwesekethe ye-analog kanye nesekethe yedijithali: Ekwakhiweni kwebhodi lesekethe, isekethe ye-analog kanye nesekethe yedijithali kusekethe kufanele kuhlukaniswe, futhi isekethe ye-analog kufanele ibe nkulu ngokufanele kunesekethe yedijithali kububanzi bomugqa wokukhiqizwa kwe-PCB. Ukusatshalaliswa kwe-analog ground kanye ne-digital ground ye-AD converter kufanele kubekwe ngokuqinile ngokwezidingo zayo ngokubhekisele kudatha yayo ye-chip.
Ukwelashwa komugqa kagesi kanye nomugqa womhlaba: Ekwakhiweni kwebhodi lesifunda, ububanzi bomugqa kagesi kanye nomugqa womhlaba kufanele bandiswe ngangokunokwenzeka, ngemva kokuba izintambo zebhodi lesifunda seziqediwe, ungqimba olungezansi noluphezulu lokwelashwa komhlaba, izingxenye ezisebhodini lesifunda zidinga ukuqiniswa ngezikhonkwane ezimbozwe ngethusi zixhunyiwe, okungathuthukisa kakhulu ukusebenza kohlelo okulwa nokuphazamiseka.
Ukuhlelwa kwe-capacitor: Ukuhlelwa kwe-capacitor kuzama ukubeka i-decoupling capacitor, i-filter capacitor kanye ne-bypass capacitor kuzungeze ingxenye ehambisanayo. Ukufakwa kwezintambo, i-pin wiring kanye ne-wiring yebhodi lesifunda eliphrintiwe kubangela ukungena, okungabangela i-ripple kanye ne-burr entanjeni kagesi, kanti ukubekwa kwe-decoupling capacitor phakathi kokunikezwa kwamandla nomhlabathi kungahlunga ngempumelelo i-ripple ephezulu.
Isikhathi sokuthunyelwe: Mashi-10-2024